发明名称 |
ELECTRONIC PACKAGES WITH THREE-DIMENSIONAL CONDUCTIVE PLANES, AND METHODS FOR FABRICATION |
摘要 |
An electronic package includes an adhesion layer between a first substrate and a second substrate. The adhesion layer is patterned to define openings aligned with through-substrate interconnects and corresponding bond pads. A conductive plane is formed between the first substrate and the second substrate, adjacent to the adhesion layer. |
申请公布号 |
WO2015164266(A1) |
申请公布日期 |
2015.10.29 |
申请号 |
WO2015US26682 |
申请日期 |
2015.04.20 |
申请人 |
RESEARCH TRIANGLE INSTITUTE |
发明人 |
VICK, ERIC, PAUL;TEMPLE, DOROTA |
分类号 |
H01L23/48;H01L21/02;H01L21/768;H01L23/00 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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