| 摘要 |
The present invention relates to a solder patterning system and a solder patterning method, capable of patterning a substrate with solder paste. The solder patterning system includes: at least one stamping pin which is lengthily formed in a longitudinal direction, and includes a flat solder print surface on a pointed end thereof; a solder printing device which firstly prints the solder print surface of the stamping pin with the solder paste; and a solder stamping device which moves the stamping pin printed with the solder paste to the substrate to pattern the substrate with the solder paste, and secondly stamps the substrate with the solder paste printed on the solder print surface by pressing the stamping pin in a substrate direction. |
