DICING TAPE PROTECTION FOR WAFER DICING USING LASER SCRIBE PROCESS

摘要

Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of scribing a semiconductor wafer having a plurality of integrated circuits involves adhering a backside of a semiconductor wafer to an inner portion of a carrier tape of a substrate carrier that includes a tape frame mounted above the carrier tape. The method also involves overlaying a protective frame above a front side of the semiconductor wafer and above an exposed outer portion of the carrier tape, the protective frame having an opening exposing an inner region of the front side of the semiconductor wafer. The method also involves laser scribing the front side of the semiconductor wafer with the protective frame in place.

主权项

1. A method of scribing a semiconductor wafer comprising a plurality of integrated circuits, the method comprising:
adhering a backside of a semiconductor wafer to an inner portion of a carrier tape of a substrate carrier comprising a tape frame mounted above the carrier tape; overlaying a protective frame above a front side of the semiconductor wafer and above an exposed outer portion of the carrier tape, the protective frame comprising an opening exposing an inner region of the front side of the semiconductor wafer; and with the protective frame in place, laser scribing the front side of the semiconductor wafer; and subsequent to the laser scribing, removing the protective frame and plasma etching the semiconductor wafer to singulate the integrated circuits.