WAFER EDGE WARP SUPPRESSION FOR THIN WAFER SUPPORTED BY TAPE FRAME

摘要

Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of reducing edge warping in a supported semiconductor wafer involves adhering a backside of a semiconductor wafer to an inner portion of a carrier tape of a substrate carrier comprising a tape frame mounted above the carrier tape. The method also involves adhering an adhesive tape to a front side of the semiconductor wafer and to at least a portion of the substrate carrier. The adhesive tape includes an opening exposing an inner region of the front side of the semiconductor wafer.

主权项

1. A method of reducing edge warping in a supported semiconductor wafer, the method comprising:
placing a backside of a semiconductor wafer on an inner portion of a carrier tape of a substrate carrier comprising a tape frame coupled to the carrier tape; and applying an adhesion layer to a front side of the semiconductor wafer and to at least a portion of the substrate carrier, the adhesion layer comprising an opening exposing an inner region of the front side of the semiconductor wafer.