| 发明名称 |
POLISHING APPARATUS AND POLISHING METHOD |
| 摘要 |
A polishing apparatus capable of performing multi-stage polishing of a substrate, such as wafer, is disclosed. The polishing apparatus includes: a plurality of polishing tables each for supporting a polishing pad; a plurality of polishing heads each configured to press a substrate against the polishing pad; and a transporting device configured to transport the substrate to at least two of the plurality of polishing heads. The plurality of polishing heads have different structures. |
| 申请公布号 |
US2015311097(A1) |
申请公布日期 |
2015.10.29 |
| 申请号 |
US201514672003 |
申请日期 |
2015.03.27 |
| 申请人 |
EBARA CORPORATION |
发明人 |
YOSHIDA Hiroshi;FUKUSHIMA Makoto;YASUDA Hozumi |
| 分类号 |
H01L21/67;B24B37/10;H01L21/306;B24B37/34 |
主分类号 |
H01L21/67 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A polishing apparatus comprising:
a plurality of polishing tables each for supporting a polishing pad; a plurality of polishing heads each configured to press a substrate against the polishing pad, the plurality of polishing heads having different structures; and a transporting device configured to transport the substrate to at least two of the plurality of polishing heads. |
| 地址 |
Tokyo JP |
