| 发明名称 |
CHEMICAL MECHANICAL POLISHING PAD |
| 摘要 |
The present disclosure relates to a radiance decomposable CMP pad, and an associated method to refresh the CMP pad. In some embodiments, the CMP pad has a polymer layer and some macro pores disposed therein. A monomer of the polymer layer has a photoactive compound unit. |
| 申请公布号 |
US2015306737(A1) |
申请公布日期 |
2015.10.29 |
| 申请号 |
US201414259646 |
申请日期 |
2014.04.23 |
| 申请人 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
发明人 |
Lin Chang-Sheng |
| 分类号 |
B24D3/34;B24B37/24 |
主分类号 |
B24D3/34 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chemical mechanical polishing (CMP) pad comprising a polymer layer and macro pores disposed therein, wherein a monomer of the polymer layer comprises a photoactive compound (PAC) unit. |
| 地址 |
Hsin-Chu TW |
