发明名称 RESIN COMPOSITION FOR ADHESIVE AND ADHESIVE CONTAINING THE SAME, ADHESIVE SHEET, AND PRINTED WIRING BOARD CONTAINING ADHESIVE SHEET AS ADHESIVE LAYER
摘要 PROBLEM TO BE SOLVED: To provide an adhesive which is excellent in adhesion to various plastic, metal and glass epoxy, moist heat resistance, and adhesion at high temperature and high humidity; and an adhesive sheet obtained from the adhesive.SOLUTION: A resin composition for an adhesive contains a thermoplastic resin (A), an inorganic filler (B), a solvent (C), and an epoxy resin (D); and satisfies the following matters: (A) is a polyester-based resin having an acid value (unit:equivalent/10g) of 100-1,000 and a number average molecular weight of 5.0×10to 1.0×10(excluding one having phenolic hydroxyl group of 150 equivalent/10g or more); (D) has a dicyclopentadiene skeleton, contains 25 pts.mass of the total of (A) and (B) based on the resin composition, has a degree of thixotropy at a liquid temperature of 25°C of 3 or more and 6 or less; an acid value AV (&bgr;) and a blended amount AW (&bgr;) of (A) (unit: pts.mass) and an epoxy value EV (γ) (unit:equivalent/10g) and a blended amount EW (γ) is 0.7≤{EV(γ)×EW(γ)}/{AV(&bgr;)×AW(&bgr;)}≤4.0.
申请公布号 JP2015187271(A) 申请公布日期 2015.10.29
申请号 JP20150084088 申请日期 2015.04.16
申请人 TOYOBO CO LTD 发明人 NANBARA SHINTARO;ITO TAKESHI;TANAKA HIDEKI;AWATA TATSUYA;IENE TAKEHISA;ASADA YUKO
分类号 C09J167/00;C08G59/24;C08G59/28;C09J7/00;C09J11/04;C09J163/00;H05K3/38 主分类号 C09J167/00
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