| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition having improved heat resistance, especially suitable for a power device, and especially provide an epoxy curable resin composition.SOLUTION: A thermosetting resin composition comprises an epoxy siloxane compound, a gallium compound, a silanol source compound and a glycidyl ester type epoxy compound, or comprises an epoxy siloxane compound, a gallium compound, a silanol source compound and an alicyclic epoxy compound. A cured product obtained by curing the composition, by the addition of these components, does not cause poor appearance such as a wrinkle and a crack, and also has high heat resistance.</p> |
