发明名称 HOUSING ASSEMBLY AND ELECTRONIC DEVICE THEREOF
摘要 A housing assembly structure is provided. The housing assembly structure includes a first housing, a second housing assembled with the first housing, a protrusion accommodating recess formed in the first housing, a hooking protrusion formed in the second housing to be accommodated in the protrusion accommodating recess in a protruding manner, and at least one contact protrusion formed in at least one area of the hooking protrusion in a protruding manner, wherein when the hooking protrusion is accommodated in the protrusion accommodating recess, the at least one contact protrusion is in contact with an inner surface of the protrusion accommodating recess.
申请公布号 US2015313029(A1) 申请公布日期 2015.10.29
申请号 US201514695943 申请日期 2015.04.24
申请人 Samsung Electronics Co., Ltd. 发明人 KIM Seong-Hyeon;Park Jung-Bae
分类号 H05K5/02;H05K5/00 主分类号 H05K5/02
代理机构 代理人
主权项 1. A housing assembly comprising: a first housing; a second housing assembled with the first housing; a protrusion accommodating recess formed in the first housing; a hooking protrusion formed in the second housing to be accommodated in the protrusion accommodating recess; and at least one contact protrusion formed in at least one area of the hooking protrusion, wherein when the hooking protrusion is accommodated in the protrusion accommodating recess, the at least one contact protrusion is in contact with an inner surface of the protrusion accommodating recess.
地址 Gyeonggi-do KR