RESIN COMPOSITION AND ITS USE

摘要

Disclosed in the present invention is a resin composition, comprising a modified polyphenylene ether resin and an organic silicon compound containing unsaturated double bonds. Also disclosed is a method for preparing a high-frequency circuit substrate using the resin composition as described above and a high-frequency circuit substrate obtained by the preparation method. The high-frequency circuit substrate of the present invention has a high glass transition temperature, a high thermal decomposition temperature, a high interlayer adhesive force, a low dielectric constant and a low dielectric loss tangent, and is very suitable as a circuit substrate in a high-frequency electronic device.

主权项

1. A resin composition comprising a modified polyphenylether resin and an organic silicon compound containing unsaturated double bonds,
wherein the organic silicon compound containing unsaturated double bonds is selected from the organic silicon compound structures containing unsaturated double bonds: wherein R21, R22 and R23 are independently selected from substituted/unsubstituted C1-C8 linear chain alkyl groups, substituted/unsubstituted C1-C8 branch chain alkyl groups, substituted/unsubstituted phenyl groups and substituted/unsubstituted C2-C10 C═C-containing groups; at least one of R21, R22 and R23 is substituted/unsubstituted C2-C10 C═C-containing groups; and 0≦m 100; or, wherein R24 is selected from substituted/unsubstituted C1-C12 linear chain alkyl groups and substituted/unsubstituted C1-C12 branch chain alkyl groups; 2≦n≦10, and n is a natural number.