发明名称 MEMORY DEVICE
摘要 Provided is a memory device, including a memory element on a substrate; a protection insulating pattern covering a side surface of the memory element and exposing a top surface of the memory element; an upper mold layer on the protection insulating pattern; and a bit line on and connected to the memory element, the bit line extending in a first direction, the protection insulating pattern including a first protection insulating pattern covering a lower side surface of the memory element; and a second protection insulating pattern covering an upper side surface of the memory element and including a different material from the first protection insulating pattern.
申请公布号 US2015311253(A1) 申请公布日期 2015.10.29
申请号 US201514602490 申请日期 2015.01.22
申请人 CHOI Young-Seok;SEO Jaehun;YANG Hyun-woo;PARK Jongchul 发明人 CHOI Young-Seok;SEO Jaehun;YANG Hyun-woo;PARK Jongchul
分类号 H01L27/22;H01L43/08;H01L43/02 主分类号 H01L27/22
代理机构 代理人
主权项 1. A memory device, comprising: a memory element on a substrate; a protection insulating pattern covering a side surface of the memory element and exposing a top surface of the memory element; an upper mold layer on the protection insulating pattern; and a bit line on and connected to the memory element, the bit line extending in a first direction, the protection insulating pattern including: a first protection insulating pattern covering a lower side surface of the memory element; and a second protection insulating pattern covering an upper side surface of the memory element and including a different material from the first protection insulating pattern.
地址 Yongin-si KR