Method of Inhibiting Copper Deposition on Hair

摘要

A method of inhibiting copper deposition on hair and facilitating the removal of copper deposited on hair including applying to the hair a shampoo composition having ethylenediamine-N,N′-disuccinic acid (EDDS) and/or histidine, rinsing the shampoo composition from the hair, applying to the hair a conditioner composition comprising histidine, rinsing the conditioner composition from the hair, and applying to the hair a leave-on treatment comprising ethylenediamine-N,N′-disuccinic acid (EDDS).

主权项

1) A method of inhibiting copper deposition on hair and facilitating the removal of copper deposited on hair comprising:
a. applying to the hair a shampoo composition comprising:
i. from about 0.025% to about 0.25% of a compound selected from the group consisting of ethylenediamine-N,N′-disuccinic acid (EDDS), derivatives of ethylenediamine-N,N′-disuccinic acid (EDDS), salts of ethylenediamine-N,N′-disuccinic acid (EDDS), histidine, and mixtures thereof, by weight of the shampoo composition;ii. from about 2% to about 50% of one or more detersive surfactants, by weight of the shampoo composition; andiii. from about 20% to about 95% of a first aqueous carrier, by weight of the shampoo composition; b. rinsing the shampoo composition from the hair; c. applying to the hair a conditioner composition comprising:
i. from about 0.025% to about 0.25% histidine, by weight of the conditioner composition;ii. a conditioner gel matrix comprising:
1. from about 0.1% to about 20% of one or more high melting point fatty compounds, by weight of the gel matrix;2. from about 0.1% to about 10% of a cationic surfactant system, by weight of the gel matrix; and3. at least 20% of a second aqueous carrier, by weight of the gel matrix; d. rinsing the conditioner composition from the hair; and e. applying to the hair a leave-on treatment comprising:
i. from about 0.025% to about 0.25% of a compound selected from the group consisting of ethylenediamine-N,N′-disuccinic acid (EDDS), derivatives of ethylenediamine-N,N′-disuccinic acid (EDDS), salts of ethylenediamine-N,N′-disuccinic acid (EDDS), and mixtures thereof, by weight of the leave-on treatment;ii. one or more rheology modifiers; andiii. at least 20% of a third aqueous carrier, by weight of the leave-on treatment.