| 发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MAINTAINING DEPOSITION APPARATUS |
| 摘要 |
A method of manufacturing a semiconductor device, includes forming an aluminum compound film on a surface of a process chamber by supplying an aluminum (Al) source to the process chamber, the surface contacting the aluminum source in the process chamber; disposing a wafer on a susceptor provided in the process chamber after forming the aluminum compound film; and forming a thin film for the semiconductor device on the wafer. |
| 申请公布号 |
US2015311062(A1) |
申请公布日期 |
2015.10.29 |
| 申请号 |
US201414578940 |
申请日期 |
2014.12.22 |
| 申请人 |
LEE Dong Yul;HAN Sang Heon;KIM Seung Hyun;KIM Jang Mi;SOLARI William;SHIM Hyun Wook;YOON Suk Ho |
发明人 |
LEE Dong Yul;HAN Sang Heon;KIM Seung Hyun;KIM Jang Mi;SOLARI William;SHIM Hyun Wook;YOON Suk Ho |
| 分类号 |
H01L21/02;H01L33/00 |
主分类号 |
H01L21/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a semiconductor device, comprising:
forming an aluminum compound film on a surface of a process chamber by supplying an aluminum (Al) source to the process chamber, the surface contacting the aluminum source in the process chamber; disposing a wafer on a susceptor provided in the process chamber after forming the aluminum compound film; and forming a thin film for the semiconductor device on the wafer. |
| 地址 |
Yongin-si KR |
