| 摘要 |
Provided is a mounting method for a self-adhesion substrate. By means of the manufacturing of a self-adhesion substrate yokeplate and the auxiliary use of a mounting manufacturing tool, it is achieved that a self-adhesion substrate welded with a plurality of electronic elements can be quickly mounted onto an arrangement part of an electronic circuit carrier of any electronic device without using any screw locking tool in the manufacturing process, thereby achieving the purposes of manufacturing procedure simplification and quick quantity production. In addition, since an electronic device with a self-adhesion substrate manufactured by means of the mounting method of the present invention does not have any bottom bearing substrate, heat generated by a plurality of electronic elements carried thereon during operation can be effectively transmitted to the electronic circuit carrier via an insulated heat-conduction adhesion layer at the bottom of the self-adhesion substrate, and the heat is dissipated in the air through the electronic circuit carrier finally, thereby achieving the purpose of effectively dissipating heat. |
