| 摘要 |
A semiconductor module is provided with three-phase upper arms (51, 53, 55) and lower arms (52, 54, 56), heat-dissipating plates (11, 12), a main circuit-side bus bar, an output terminal-side bus bar, a control terminal (14), and a resin mold part (18). The output terminal-side bus bar has U-phase to W-phase wiring layers (133-135) layered and arranged facing each other interposed by an insulating layer (130), and U-W terminals (13c-13e) for electrically connecting each of the U-phase to W-phase wiring layers and a load. There are an even number of U-phase to W-phase wiring layers. |
