发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF |
摘要 |
There is provided semiconductor devices and methods of forming the same, the semiconductor devices including: a first semiconductor element having a first electrode; a second semiconductor element having a second electrode; a Sn-based micro-solder bump formed on the second electrode; and a concave bump pad including the first electrode opposite to the micro-solder bump, where the first electrode is connected to the second electrode via the micro-solder bump and the concave bump pad. |
申请公布号 |
WO2015162872(A1) |
申请公布日期 |
2015.10.29 |
申请号 |
WO2015JP02071 |
申请日期 |
2015.04.15 |
申请人 |
SONY CORPORATION |
发明人 |
WAKIYAMA, SATORU;JYO, NAOKI;SHIMIZU, KAN;HAYASHI, TOSHIHIKO;NAKAMURA, TAKUYA |
分类号 |
H01L21/60;H01L23/485 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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