LED CARRIER AND MANUFACTURING METHOD THEREOF

摘要

An LED carrier includes a substrate, a metallic layer, an insulating layer, and a reflecting layer. The metallic layer is disposed on the substrate and has a die bonding region and a ring-shaped wiring region separated from the die bonding region. A region arranged between the die bonding region and the ring-shaped wiring region is defined as an insulating region. The insulating layer at least partially covers the insulating region. The reflecting layer is arranged above the die bonding region and at least partially covers the top surface of the insulating layer. Moreover, the instant disclosure also provides a manufacturing method of an LED carrier.

主权项

1. An LED carrier for mounting at least one LED die, comprising:
a substrate; a metallic layer disposed on the substrate and having a die bonding region and a ring-shaped wiring region, the ring-shaped wiring region arranged around the die bonding region and spaced apart from the die bonding region, a ring-shaped groove formed between the die bonding region and the ring-shaped wiring region; an insulating layer at least partially disposed in the ring-shaped groove; and a reflecting layer disposed above the die bonding region and at least partially covering the ring-shaped groove, wherein the at least one LED die is disposed on the reflecting layer and arranged in the die bonding region, and the at least one LED die is electrically connected to the ring-shaped wiring region.