| 摘要 |
A wiring circuit board provided with: a metallic pedestal part (60) that is formed from the same metallic material as a metallic support substrate for a pad part (33); a pedestal opening part (34) at which the metallic pedestal part (60) is open; a lower conductive layer (61) as a first conductive layer that is disposed on one thickness-direction side of the metallic pedestal part (60); and an upper conductive layer (62) as a second conductive layer that is formed on one thickness-direction side of the lower conductive layer (61), which is the first conductive layer. Either the lower conductive layer (61) that is the first conductive layer or the upper conductive layer (62) that is the second conductive layer fit within the pedestal opening part (34) when the wiring circuit board is projected in the thickness direction, and the peripheral edge of the other conductive layer is disposed outside of the pedestal opening part (34) when the wiring circuit board is projected in the thickness direction. |
