发明名称 フラット回路体の取付方法
摘要 PROBLEM TO BE SOLVED: To provide a method for mounting a flat circuit body capable of improving productivity of the flat circuit body without thermal fusion process of a separate component in manufacturing of the flat circuit body, and shortening the mounting operation time by suppressing occurrence of deformation or the like which delays the mounting operation time at peripheral parts of mounting holes.SOLUTION: A flat circuit body 10 comprises: a plurality of conductors 11 which become electric wire conductors; a sheet-like insulating coating material 12 which holds the plurality of conductors 11 in a plane state at a predetermined separation gap from each other; and slits 13 which are mounting holes and are formed on the insulating coating material 12. A housing 20 on which the flat circuit body 10 is mounted comprises resin-made columnar protrusions 21 protrusively provided so as to be inserted into the slits 13 on an area where the flat circuit body 10 is arranged. The flat circuit body 10 is fixed to the housing 20 by expanding diameters of the top parts of the resin-made columnar protrusions 21 protruded from the slits 13 by heating formation after the resin-made columnar protrusions 21 have been inserted into the slits 13.
申请公布号 JP5802067(B2) 申请公布日期 2015.10.28
申请号 JP20110144499 申请日期 2011.06.29
申请人 发明人
分类号 H02G3/30;F16B19/08 主分类号 H02G3/30
代理机构 代理人
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