| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a curable resin composition capable of forming coating films excellent in chemical resistance, even when a curing temperature is <200°C. <P>SOLUTION: The curable resin composition comprises the following (A), (B), (C), (D) and (E), wherein the content of (B) is 1 to 100 pts.mass per 100 pts.mass of (A): (A) a copolymer comprising structural units originated from at least one selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic acid anhydrides, and structural units originated from a monomer having the epoxidized structure of an unsaturated alicyclic hydrocarbon and a carbon-carbon unsaturated double bond, and having an acid value of≥30 to≤180 mg-KOH/g; (B) an epoxy resin having an acid value of <30 mg-KOH/g; (C) a compound having two or more of at least one kind of groups selected from the group consisting of acryloyl group and methacryloyl group; (D) a thermally acid-generating agent; and (E) a solvent. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
