| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive element having excellent adhesiveness and resolution, and fewer minute defects of the resist, from which a resist pattern having a nearly rectangular cross-sectional profile can be formed, and to provide a method for forming a resist pattern and a method for manufacturing a printed wiring board by using the photosensitive element. <P>SOLUTION: A photosensitive element 1 includes a support film 10, a photosensitive layer 20 formed thereon, and a protective film. The support film shows a haze of 0.01 to 1.5%. The total number of particles having a diameter of 5 μm or more and aggregates having a diameter of 5 μm or more included in the support film is 5 /mm<SP POS="POST">2</SP>or less. The photosensitive layer comprises a binder polymer, a photopolymerizable compound having an ethylenically unsaturated bond, and a photopolymerization initiator, and satisfies a relationship of 0.005≤A/T≤0.020 between a thickness T (μm) and an absorbance A at a wavelength of 365 nm. The protective film has an oxygen permeability of 5×10<SP POS="POST">-2</SP>m<SP POS="POST">3</SP>/m<SP POS="POST">2</SP>day MPa or less. <P>COPYRIGHT: (C)2013,JPO&INPIT |
