发明名称 メッキ処理工程の水処理装置とメッキ処理工程の水処理方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a water treatment apparatus for a plating process that is a water treatment apparatus enabled to remove organic matter with sterilized and purified plating treatment water, and can maintain a high cleaning function in a water treatment by being connected to existent treatment tanks to remove slime and mold in the respective treatment tanks and to prevent them from sticking while suppressing treatment tanks in a plating process from becoming large in size. <P>SOLUTION: The water treatment apparatus for a plating process is constituted by connecting an inflow path 60 and an outflow path 61 of a sterilization and purification unit 3, having three organically combined functions of an ozone supply part 15 which supplies ozone, an ultraviolet-ray irradiation part 16 which achieves irradiation with ultraviolet rays, and a photocatalysis part 17 which makes a photocatalyst 33 act, to various treatment tanks 2 in the plating process in a circulable state, and configured to remove organic matter 63 in water 62 to be treated by circulating plating water 5 having been sterilized and purified through the sterilization and purification unit 3. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5802483(B2) 申请公布日期 2015.10.28
申请号 JP20110183391 申请日期 2011.08.25
申请人 发明人
分类号 C02F1/72;C02F1/32;C02F1/78;C25D13/24 主分类号 C02F1/72
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