发明名称 METHOD OF MANUFACTURING A CIRCUIT BOARD
摘要 The present invention separates a metal mask from a substrate by loading a pressing bar on the metal mask, after solder paste is printed through an opening part of the metal mask using a squeeze device. The pressing bar according to the present invention includes a brush on the lower side thereof, and pushes the solder paste from the opening part toward the bottom by inputting the brush into the opening part of the metal mask when the metal mask is lifted and separated from the substrate. As a result, the solder paste is transferred to the substrate not to remain in the opening part of the metal mask.
申请公布号 KR101563508(B1) 申请公布日期 2015.10.28
申请号 KR20140061600 申请日期 2014.05.22
申请人 发明人
分类号 H05K3/34;B41F15/42 主分类号 H05K3/34
代理机构 代理人
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