摘要 |
The present invention relates to a composite resin composition for plugging a hole and a method for plugging a hole using the same and, more specifically, to a composite resin composition for plugging a hole, comprising: an epoxy resin; and an inorganic filler, and a method for plugging a hole using the same. The present invention provides a composite resin composition for plugging a hole which is easy to remove bubbles inside the hole using magnetic force and improves thermal conductivity and thermal resistance. |