METHODS AND APPARATUS FOR GLASS REMOVAL IN CMOS IMAGE SENSORS

摘要

Disclosed is a method for glass removal while forming a CMOS image sensor. Provided is a method for forming a device, which includes the following steps: forming a plurality of pixel arrays on a device wafer; bonding a carrier wafer to a first side of the device wafer; bonding a substrate to a second side of the device wafer; thinning the carrier wafer; forming an electrical connection unit to the first side of the device wafer; subsequently de-bonding the substrate from the second side of the device wafer; and subsequently singulating an individual pixel array of the pixel arrays from the device wafer. An apparatus is also disclosed.