SEMICONDUCTOR DEVICE, METHOD FOR ATTACHING HEAT DISSIPATING MEMBER TO SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

An object of the present invention is to improve heat dissipation of a semiconductor device. By fastening a semiconductor device (10) to a heat dissipation member (80), a force directed downward in the diagram acts from a metal substrate (40) onto the heat dissipation member (80), with a rim portion (52) of a storage region (51) as a fulcrum with respect to the heat dissipation member (80). As a result, a heat conductive material (81) can be spread into a thinner layer between the metal substrate (40) and the heat dissipation member (80), improving the heat dissipation between the metal substrate (40) and the heat dissipation member (80). Furthermore, the heat conductive material (81) that is spread outside the metal substrate (40) fills the periphery of the metal substrate (40). This leads to an increase in air tightness of the periphery of the metal substrate (40), inhibiting bubbles and the like from being mixed therein and preventing the deterioration of the heat dissipation. Heat dissipation of the semiconductor device (10) to which the heat dissipation member (80) is installed in this manner can be improved.