| 摘要 |
The present invention comprises a vacuum pump for forming the inside of a process chamber to be in a vacuum state by supplying external air from the process chamber and inhaling air inside the chamber when vacuum forming a semiconductor substrate such as a silicon wafer or the like. The vacuum pump is prepared together with an air pump to solve problems such as a number of failures caused by a foreign material of the moisture included in air or the like, and reducing durability. Accordingly, by removing the moisture from the vacuum pump, preventing the failures can be achieved. |
