| 摘要 |
The present invention relates to a slag removal apparatus of a support rail for laser processing and, more specifically, relates to a slag removal apparatus of a support rail for laser processing wherein a laser processing apparatus for cut-processing a central portion of a processed article of a metal plate; easily and quickly removing slag (melted metal, impurity residue, etc.) clotted while flowing down to a support rail where the processed article is supported; and introducing a removing member having a contact bumping portion touching a side of the support rail on a lower part of the body moving along the support rail to improve user convenience and allowing the removing member to move in a longitudinal and a transverse direction through a driving means to remove the clotted slag. |
