| 摘要 |
A semiconductor device capable of being formed on a sealing part easily and having a shielding effect, and a manufacturing method of the semiconductor device are provided. The manufacturing method of the semiconductor device related by the embodiment comprises the following steps: placing semiconductor chips on installation parts of lead frames which enable first terminals and second terminals thinner than the first terminals to be arranged at intervals aiming at the surroundings of the installation parts, sealing the semiconductor chips and the lead frames through resin, enabling resin forming bottom surfaces to be located in ditches between upper surfaces of the first terminals and upper surfaces of the second terminals, filling the ditches, covering surfaces of the resin, forming conductor layers in a manner that the conductor layers are connected with the first terminals and electrically insulated with the second terminals, and cutting off resin in the thickness direction in a manner that cross sections of conductor layers filled in the ditches are exposed. |
