| 摘要 |
Embodiments of the present invention relate to high temperature anti-droop end effectors for transferring semiconductor substrates. One embodiment of the present invention provides an end effector (110; 210) for using with a substrate handler. The end effector (110; 210) comprises a free end (124; 224) having a substrate supporting plane configured to support a substrate and positioned that substrate at a first angle relative to a horizontal plane. The end effector (110; 210) comprises a fixed end (111; 211) configured to be mounted to the substrate handler, wherein the end effector (110; 210) is mounted to the substrate handler at a position that the substrate supporting plane is at a second angle relative to the horizontal plane when no substrate is disposed on the free end (124; 224), and the first angle is different from the second angle. |
