| 摘要 |
<p>Provided is an adhesive sheet which can prevent the occurrence of defects when cutting microcomponents such as electronic components. This adhesive sheet is provided with an adhesive layer and a resin layer disposed on one side of the adhesive layer, and when cutting grooves are formed from the adhesive layer side in a manner penetrating the adhesive layer, the cutting grooves do not disappear for one hour following formation of the cutting grooves. In a preferred embodiment, the thickness of the adhesive layer is no larger than 50μm.</p> |
