| 摘要 |
<p>A lead type piezoelectric resonator device includes a piezoelectric resonator plate and a lead terminal that supports the piezoelectric resonator plate. The piezoelectric resonator plate is provided with a terminal electrode that is electrically connected to the lead terminal, and the lead terminal is provided with a bonding layer that is electrically connected to the piezoelectric resonator plate. The piezoelectric resonator plate and the lead terminal are electromechanically bonded to each other by the terminal electrode and the bonding layer. A bonding material containing an Sn—Cu alloy is produced from the terminal electrode and the bonding layer by the bonding of the terminal electrode and the bonding layer.</p> |
