| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a film forming method and a film forming apparatus that achieve high adhesion between an organic layer comprising a fluorine-containing resin and an inorganic layer, which are film-formed. <P>SOLUTION: The film forming method is provided, wherein an organic layer comprising a fluorine-containing resin is formed on an inorganic layer 3 comprising an inorganic matter which is film-formed on a substrate to be treated 2. When the inorganic layer is formed, the inorganic layer is formed on the substrate to be treated by performing reactive sputtering using water vapor as reactive gas, and then the organic layer is formed on the inorganic layer. The film forming method can be performed with the film forming apparatus. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
