发明名称 PROCEDURE FOR THE MANUFACTURE AND ASSEMBLY OF ELECTRONIC BOARDS AND ELECTRONIC DEVICE THUS OBTAINABLE
摘要 <p>The procedure for the manufacture and assembly of electronic boards includes the steps of: arranging a first electronic board (2) having a first power connector (7) of substantially elongated shape; arranging a second electronic board (10) having a through opening (14) suitable for allowing the passage of the first power connector (7); arranging a third electronic board (15) including a power circuit and having a second power connector (18) which can be connected to the first power connector (7); associating the second electronic board (10) with the first electronic board (2), wherein the step of associating includes inserting the first power connector (7) through the through opening (14); associating the third electronic board (15) with the second electronic board (10), wherein the step of associating includes connecting the second power connector (18) to the first power connector (7).</p>
申请公布号 EP2936948(A1) 申请公布日期 2015.10.28
申请号 EP20130828819 申请日期 2013.12.12
申请人 META SYSTEM S.P.A. 发明人 LASAGNI, CESARE
分类号 H05K1/14;H05K1/02;H05K3/30;H05K3/36 主分类号 H05K1/14
代理机构 代理人
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