| 主权项 |
1. A computer-implemented method for inspecting a wafer, comprising:
identifying multiple instances of structures in a design for a wafer, wherein the structures have the same or substantially the same geometrical characteristics, wherein each of the structures included in the multiple instances comprises a single continuous structure, and wherein said identifying is performed using design data for the design; comparing output of an inspection system generated for two or more of the multiple instances of the single continuous structures formed on the wafer to each other, wherein the two or more of the multiple instances are located within the same die on the wafer, and wherein the output that is compared for the two or more of the multiple instances comprises all of the output generated for the single continuous structures included in the two or more of the multiple instances; and detecting defects on the wafer based on results of said comparing, wherein said identifying, said comparing, and said detecting are performed using a computer system. |
