发明名称 EPOXY RESIN COMPOSITE AND PRINTED CURCUIT BOARD COMPRISING INSULATING LAYER USING THE SAME
摘要 An epoxy resin composition according to an embodiment of the present invention includes 3-60 wt% of an epoxy compound including a crystalline epoxy compound, 0.5-22 wt% of a curing agent, and 18-96.5 wt% of an inorganic filler including a glass fiber.
申请公布号 KR20150120217(A) 申请公布日期 2015.10.27
申请号 KR20140046200 申请日期 2014.04.17
申请人 LG INNOTEK CO., LTD. 发明人 CHUNG, HEE YOUNG;OH, WOON SU;LEE, JONG SIK;HAN, YOUNG JU
分类号 C08L63/00;C08G59/44;C08K7/14;H05K1/03 主分类号 C08L63/00
代理机构 代理人
主权项
地址