Adaptive temperature and power calculation for integrated circuits

摘要

Methods, apparatus, and fabrication processes relating to thermal calculations of an integrated circuit device are reported. The methods may comprise determining a power consumption by a power entity of an integrated circuit, the power entity comprising at least one functional element of the integrated circuit; determining a temperature of a thermal entity, the thermal entity comprising a subset of the power entity; and adjusting at least one of a voltage or an operating frequency of at least one functional element of the power entity, based upon the temperature of the thermal entity being greater than or equal to a predetermined threshold temperature for the thermal entity.

主权项

1. A method, comprising:
determining a power consumption by a power entity of an integrated circuit, the power entity comprising at least one functional element of the integrated circuit; determining a temperature of a thermal entity, the thermal entity comprising a subset of the power entity, wherein the temperature of the thermal entity is determined based at least in part on a coefficient of thermal transfer from the thermal entity to each other thermal entity of the integrated circuit and further based at least in part on power consumption of functional elements of the power entity; and adjusting at least one of a voltage or an operating frequency of at least one functional element of the power entity, based upon the temperature of the thermal entity being greater than or equal to a predetermined threshold temperature for the thermal entity.