发明名称 |
Electronic device module comprising an ethylene multi-block copolymer |
摘要 |
An electronic device module comprises:
A. At least one electronic device, e.g., a solar cell, andB. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer.
Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0.90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked. |
申请公布号 |
US9169340(B2) |
申请公布日期 |
2015.10.27 |
申请号 |
US201213667722 |
申请日期 |
2012.11.02 |
申请人 |
Dow Global Technologies LLC |
发明人 |
Patel Rajen M.;Wu Shaofu;Bernius Mark T.;Esseghir Mohamed;McGee Robert L.;Mazor Michael H.;Naumovitz John A. |
分类号 |
C08F210/02;H01L31/048;B32B17/10 |
主分类号 |
C08F210/02 |
代理机构 |
Whyte Hirschboeck Dudek S.C. |
代理人 |
Whyte Hirschboeck Dudek S.C. |
主权项 |
1. An electronic device module comprising:
A. At least one solar cell, B. An encapsulant film in intimate contact with at least one surface of the solar cell and comprising a polymeric material, the polymeric material comprising a reaction product of at least: (1) an ethylene multi-block copolymer characterized by (i) a molecular fraction that elutes between about 40 C and about 130 C when fractionated using TREF, characterized in that the fraction has a block index of at least 0.5 and up to about 1 and a MWD greater than about 1.3, (ii) an average block index greater than zero and up to about 1.0 and an MWD greater than about 1.3, (iii) a melt point of less than about 125 C, (iv) a density of from less than 0.89 g/cc to greater than 0.85 g/cc, and (v) having at least one property of (a) a 2% secant modulus of less than about 150 megaPascal (mPa) as measured by ASTM D-882-02, (b) an α-olefin content of at least about 10 and less than about 80 weight percent (wt %) based on the weight of the copolymer, and (c) a Tg of less than about −35 C, (2) a vinyl silane in an amount of at least about 0.1 wt % based on the weight of the copolymer, and (3) optionally, a co-agent, wherein the polymeric material has greater than or equal to 92% transmittance over the wavelength range of 400 to 1100 nanometers, and a water vapor transmission rate of less than about 50 grams per square meters per day (g/m2-day), C. A cover sheet in intimate contact with at least a portion of the encapsulant film, and D. A backsheet in intimate contact with at least one of the solar cell and the encapsulant film, wherein the encapsulant film is between the cover sheet and the backsheet. |
地址 |
Midland MI US |