Hybrid integrated component and method for the manufacture thereof

摘要

An expansion of the functional scope of a hybrid integrated component including an MEMS element, a cap for the micromechanical structure of the MEMS element, and an ASIC element having circuit components is provided. In this component, the circuit components of the ASIC element interact with the micromechanical structure of the MEMS element. The MEMS element is mounted on the ASIC element in such a way that the micromechanical structure of the MEMS element is situated in a cavity between the cap and the ASIC element. The ASIC element is additionally equipped with the circuit components of a magnetic sensor system. These circuit components are produced in or on the CMOS back-end stack of the ASIC element. The magnetic sensor system may thus be implemented without enlarging the chip area.

主权项

1. A hybrid integrated component, comprising:
an MEMS element; a cap for a micromechanical structure of the MEMS element; and an ASIC element including circuit components that interact with the micromechanical structure of the MEMS element, wherein the MEMS element is mounted on the ASIC element so that the micromechanical structure of the MEMS element is situated in a cavity between the cap and the ASIC element, and wherein the ASIC element includes:
circuit components of a magnetic sensor system, the circuit components including two coil elements arranged one inside the other, the two coil elements having upper sections and lower sections offset from each other; andat least one remagnetizable layer area as a coil core for the two coil elements,wherein one of the two coil elements is configured as at least one exciter coil for remagnetizing the coil core, andwherein the other of the two coil elements is configured as at least one measuring coil for detecting a change of the magnetic flux thus caused.