Impedance controlled LGA interposer assembly

摘要

An interposer plate assembly having an insulating plate and metal contacts in the plate with contact points above and below the plate and a central portion in the plate. Two cantilever arms extend from the central portion to each contact point. The central portion may be formed to have a large area to form an impedance shield for reducing impedance between adjacent signal contacts. Plastic bodies may be overmolded on separate contacts or on contact pairs and may have sliding fits in passages of the interposer plate. Contacts may be arranged as differential pairs with ground contacts located between the differential pairs.

主权项

1. An interposer plate assembly for forming electrical connections between contacts on opposed substrates, the assembly comprising an insulating plate having a top surface, a bottom surface and a thickness between the top surface and the bottom surface; and a plurality of one-piece metal contacts, each contact comprising a central portion in the insulating plate, a first contact point spaced from one surface of the insulating plate to engage a pad, two first cantilever arms extending from the central portion to the contact point, and a first opening through the contact between the arms; the insulating plate including a number of through passages; plastic bodies on the contact central portions, said bodies in said passages; and said bodies movable in said passages.