| 发明名称 | Sealing composition for semiconductor, semiconductor device and method of producing the same, and polymer and method of producing the same | ||
| 摘要 | In the invention, a sealing composition for a semiconductor is provided which includes a polymer that includes two or more cationic functional groups including at least one of a tertiary nitrogen atom or a quaternary nitrogen atom, that has a weight average molecular weight of from 2,000 to 1,000,000, and that has a branching degree of 48% or more, wherein a content of sodium and a content of potassium in the sealing composition are each 10 ppb by weight or less on an element basis. | ||
| 申请公布号 | US9169353(B2) | 申请公布日期 | 2015.10.27 |
| 申请号 | US201314372237 | 申请日期 | 2013.01.16 |
| 申请人 | MITSUI CHEMICALS, INC. | 发明人 | Ono Shoko;Kayaba Yasuhisa;Tanaka Hirofumi;Kohmura Kazuo;Suzuki Tsuneji;Mio Shigeru |
| 分类号 | C08G73/02;H01L23/29;H01L21/02;H01L23/532;H01L21/56;C09J179/02;C09K3/10 | 主分类号 | C08G73/02 |
| 代理机构 | Buchanan, Ingersoll & Rooney PC | 代理人 | Buchanan, Ingersoll & Rooney PC |
| 主权项 | 1. A sealing composition for a semiconductor, comprising a polymer that includes two or more cationic functional groups including at least one of a tertiary nitrogen atom or a quaternary nitrogen atom, that has a weight average molecular weight of from 20,000 to 1,000,000, and that has a branching degree of 48% or more, wherein the polymer includes primary nitrogen atoms, and a proportion of the primary nitrogen atoms to all the nitrogen atoms in the polymer is 33% by mole or more, and wherein a content of sodium and a content of potassium in the sealing composition are each 10 ppb by weight or less on an element basis. | ||
| 地址 | Tokyo JP | ||