发明名称 |
E-fuse with hybrid metallization |
摘要 |
A structure including a first interconnect including a first line overlying a first via and a second interconnect including a second line overlying a second via. The first line and the second line are co-planar. The first interconnect comprises a first conductor, the first conductor comprises a metal silicide including titanium silicide, cobalt silicide, nickel silicide, tungsten silicide, platinum silicide, molybdenum silicide, tantalum silicide, or some combination thereof. The second interconnect comprises a second conductor, the second conductor comprising copper. |
申请公布号 |
US9171801(B2) |
申请公布日期 |
2015.10.27 |
申请号 |
US201414291027 |
申请日期 |
2014.05.30 |
申请人 |
GLOBALFOUNDRIES U.S. 2 LLC |
发明人 |
Bao Junjing;Bonilla Griselda;Choi Samuel S.;Filippi Ronald G.;Lustig Naftali E.;Simon Andrew H. |
分类号 |
H01L23/525;H01L23/532;H01L23/29 |
主分类号 |
H01L23/525 |
代理机构 |
Roberts Mlotkowski Safran & Cole, P.C. |
代理人 |
Ivers Catherine;Roberts Mlotkowski Safran & Cole, P.C. |
主权项 |
1. A structure comprising:
a first interconnect including a first line overlying a first via; and a second interconnect including a second line overlying a second via; wherein a top surface of the first line and a top surface of the second line are coplanar; wherein the first interconnect comprises a first conductor and a first liner, the first conductor comprises a metal silicide including titanium silicide, cobalt silicide, nickel silicide, tungsten silicide, platinum silicide, molybdenum silicide, tantalum silicide, or a combination thereof; and wherein the second interconnect comprises a second conductor and a second liner, the second conductor comprising copper, the first conductor and the second conductor are separated by both the first liner and the second liner such that a distance between the first conductor and the second conductor is equal to a wall thickness of the first liner plus a wall thickness of the second liner. |
地址 |
Hopewell Junction NY US |