| 主权项 |
1. A semiconductor device comprising:
an insulating substrate joined with a semiconductor chip; a case covering a surface of the insulating substrate where the semiconductor chip is joined, and having a lid disposed above a surface of the insulating substrate where the semiconductor chip is joined; and a control terminal having one end portion electrically connected to the semiconductor chip, and another end portion passing through the lid and exposed to outside of the case, wherein the control terminal includes a through section exposed to the outside of the case and extending perpendicular to the insulating substrate, the through section having a cut-out section where a part of the exposed portion is cut out, and a blocking section surrounded by the cut-out section and bent laterally outwardly at one end thereof, the blocking section contacting the lid and blocking a movement of the control terminal; a connection section extending parallel to the through section, and having one end portion connected to the insulating substrate; and a linking section connecting the through section and the connection section on a side where the blocking section is not disposed, the linking section having a flat surface orthogonal to the through section to absorb a compressive load applied to the through section, and wherein the lid includes a through hole, through which the through section passes, the through hole having a width in a lateral direction corresponding to a thickness of the through section; a step provided at a side section of the through hole and extending from an upper surface of the lid exposed to the outside of the case, the step contacting the blocking section; and a protrusion provided on a side opposite to the step relative to the through hole and contacting the flat surface of the linking section, the protrusion having a size such that when the protrusion contacts the flat surface of the linking section, a free end of the blocking section is exposed inside the step. |
