| 发明名称 | Light-emitting element mounting substrate and light-emitting device | ||
| 摘要 | There are provided a light-emitting element mounting substrate having high bonding strength between a substrate main body and a metal portion, and a light-emitting device having high bonding strength between the substrate main body and the metal portion and high reliability. A light-emitting element mounting substrate includes a substrate main body (20) formed of a ceramic sintered body; and a silver-containing metal portion (2), a silver-containing region (4) existing in a portion of the substrate main body which faces the metal portion across a bonding portion bonding the substrate main body and the silver-containing metal portion. Accordingly, it is possible to increase bonding strength between the substrate main body (20) and the metal portion (2). | ||
| 申请公布号 | US9170003(B2) | 申请公布日期 | 2015.10.27 |
| 申请号 | US201113989570 | 申请日期 | 2011.11.25 |
| 申请人 | Kyocera Corporation | 发明人 | Arai Takeyuki;Nakasuga Minoru;Nakamoto Tetsurou |
| 分类号 | F21V19/00;F21V21/00;H01L33/48;H01L33/60 | 主分类号 | F21V19/00 |
| 代理机构 | Volpe and Koenig, P.C. | 代理人 | Volpe and Koenig, P.C. |
| 主权项 | 1. A light-emitting element mounting substrate for mounting a light-emitting element thereon, comprising: a substrate main body formed of a ceramic sintered body, the substrate main body containing magnesium; and a silver-containing metal portion containing silver as a main component, and magnesium and bismuth as accessory components, a silver-containing region existing in a portion of the substrate main body which faces the metal portion across a bonding portion bonding the substrate main body and the silver-containing metal portion, the silver-containing region containing silver, magnesium and bismuth. | ||
| 地址 | Kyoto JP | ||