APPARATUS AND METHOD OF COMPENSATING CHEMICAL MECHANICAL POLISHING PROCESS

摘要

The present invention relates to an apparatus for controlling compensation of a chemical mechanical polishing process and a method thereof. The apparatus includes: a parameter measurement part for measuring a parameter during the chemical mechanical polishing process; a display for displaying a measurement value of the parameter by receiving data obtained in the parameter measurement step; an input part which is inputted with rough distribution of the measurement value of the parameter displayed in the display step in one line type by touching; and a parameter compensation part which removes a deviation of the measurement value of the parameter by controlling the chemical mechanical polishing process in the type inputted in the input step. By performing a compensation control process in the parameter compensation part according to a shape and a slope of an inputted curve, the compensation control process performed in the parameter compensation part is simplified, and a line for the compensation process is inputted to the input part around an area requiring parameter compensation most by a worker. Thus, the parameter compensation process is done in a manner to correct abrupt deviation first, and the deviation of the parameter is compensated within a short time.