发明名称 |
Light emitting lamp |
摘要 |
Disclosed is a light emitting lamp including a light source module including at least one light source and a light guide layer disposed on a substrate burying the at least one light source, and a housing accommodating the light source module, and the at least one light source includes a body having a cavity, a first lead frame including one end exposed to the cavity and the other end passing through the body and exposed to one surface of the body, a second lead frame including one end exposed to one portion of the surface of the body, the other end exposed to the another portion of the surface of the body, and an intermediate part exposed to the cavity, and at least one light emitting chip including a first semiconductor layer, an active layer and a second semiconductor layer, and disposed on the first lead frame. |
申请公布号 |
US9171998(B2) |
申请公布日期 |
2015.10.27 |
申请号 |
US201313738800 |
申请日期 |
2013.01.10 |
申请人 |
LG Innotek Co., Ltd. |
发明人 |
Oh Nam Seok;Cho Young Jun;Choi Kwang Kyu;Moon Young Min;Moon Sun Mi |
分类号 |
H01L33/48;H01L33/38;H01L33/08;F21S8/10;F21V8/00;G09G3/34 |
主分类号 |
H01L33/48 |
代理机构 |
Ked & Assocaites, LLP |
代理人 |
Ked & Assocaites, LLP |
主权项 |
1. A light emitting device package, comprising:
a package body having a cavity formed by a surface of the package body; a first lead frame including a first end exposed to the cavity and a second end passing through the package body and exposed at a surface of the package body; a second lead frame including a first end exposed at a first end of the surface of the package body, a second end exposed at a second end of the surface of the package body, and an intermediate part exposed to the cavity; and at least one light emitting chip arranged on the first lead frame, the at least one light emitting chip including a first semiconductor layer, an active layer and a second semiconductor layer, wherein the second end of the first lead frame is provided between the first and second ends of the second lead frame. |
地址 |
Seoul KR |