发明名称 Fixture for component to be mounted to circuit board
摘要 An object is to provide a fixture for a component to be mounted on a circuit board which is easily manufactured and can exhibit good solderability and high whisker resistance. In a fixture which includes a solder joint plate part 11 that can be fixed on a surface of a circuit board by soldering using solder cream, and a component fixing part 12 that can be fixed to a component configured to be mounted on the circuit board, and in which Sn plating is performed at least on a solder joint surface of the solder joint plate part, the solder joint plate part 11 is divided into a plurality of long-plate-like solder joint pieces 13, and on both sides of each of the long-plate-like solder joint pieces 13, wing-like joint feet are provided to protrude through bent flexible parts 16, and the lower surface of each of the joint feet 15 becomes a solder joint surface 18 to be joined with the surface of the circuit board by solder cream.
申请公布号 US9171651(B2) 申请公布日期 2015.10.27
申请号 US201113813712 申请日期 2011.08.01
申请人 Yazaki Corporation 发明人 Muro Takashi
分类号 H01R12/77;H01R12/72;H01R13/60;H01B1/00;H01R12/70;H01R13/03 主分类号 H01R12/77
代理机构 Sughrue Mion, PLLC 代理人 Sughrue Mion, PLLC
主权项 1. A fixture for a component to be mounted on a circuit board, comprising: a solder joint plate part to be fixed on a surface of a circuit board by soldering using solder cream; and a component fixing part fixed to a component to be mounted on the circuit board; wherein Sn plating is performed at least on a solder joint surface of the solder joint plate part; the solder joint plate part includes slits formed from an end edge of the component fixing part to a position close to the component fixing part so that the solder joint plate part is divided into a plurality of long-plate-like solder joint pieces separated by the slits and extending in a first direction; cut portions extending in a second direction perpendicular to the first direction are formed on both side edges, so that wing-like joint feet are provided which extend in the second direction, said joint feet being connected to the solder joint pieces through flexible parts which are bent in a thickness direction perpendicular to the first and second directions; and a lower surface of each of the joint feet becomes the solder joint surface to be joined with the surface of the circuit board by the solder cream.
地址 Tokyo JP