发明名称 |
Fixture for component to be mounted to circuit board |
摘要 |
An object is to provide a fixture for a component to be mounted on a circuit board which is easily manufactured and can exhibit good solderability and high whisker resistance. In a fixture which includes a solder joint plate part 11 that can be fixed on a surface of a circuit board by soldering using solder cream, and a component fixing part 12 that can be fixed to a component configured to be mounted on the circuit board, and in which Sn plating is performed at least on a solder joint surface of the solder joint plate part, the solder joint plate part 11 is divided into a plurality of long-plate-like solder joint pieces 13, and on both sides of each of the long-plate-like solder joint pieces 13, wing-like joint feet are provided to protrude through bent flexible parts 16, and the lower surface of each of the joint feet 15 becomes a solder joint surface 18 to be joined with the surface of the circuit board by solder cream. |
申请公布号 |
US9171651(B2) |
申请公布日期 |
2015.10.27 |
申请号 |
US201113813712 |
申请日期 |
2011.08.01 |
申请人 |
Yazaki Corporation |
发明人 |
Muro Takashi |
分类号 |
H01R12/77;H01R12/72;H01R13/60;H01B1/00;H01R12/70;H01R13/03 |
主分类号 |
H01R12/77 |
代理机构 |
Sughrue Mion, PLLC |
代理人 |
Sughrue Mion, PLLC |
主权项 |
1. A fixture for a component to be mounted on a circuit board, comprising:
a solder joint plate part to be fixed on a surface of a circuit board by soldering using solder cream; and a component fixing part fixed to a component to be mounted on the circuit board; wherein Sn plating is performed at least on a solder joint surface of the solder joint plate part; the solder joint plate part includes slits formed from an end edge of the component fixing part to a position close to the component fixing part so that the solder joint plate part is divided into a plurality of long-plate-like solder joint pieces separated by the slits and extending in a first direction; cut portions extending in a second direction perpendicular to the first direction are formed on both side edges, so that wing-like joint feet are provided which extend in the second direction, said joint feet being connected to the solder joint pieces through flexible parts which are bent in a thickness direction perpendicular to the first and second directions; and a lower surface of each of the joint feet becomes the solder joint surface to be joined with the surface of the circuit board by the solder cream. |
地址 |
Tokyo JP |