DIE BONDING APPARATUS

摘要

The present invention relates to a die bonding device. The die bonding device according to an embodiment of the present invention comprises: a wafer holder for supporting a wafer on which a die is formed; an ejector holder for supporting a die ejector which assists separation of the die from the wafer wherein the ejector holder is located on an inner side of the wafer holder to be located under the wafer; a support unit for supporting a substrate to which the die is to be attached; a bonding unit for attaching the die to the substrate by picking up the die from the wafer; an ejector buffer unit accommodating the die ejector; and an exchange unit for transferring the ejector holder between the ejector holder and the ejector buffer unit.