Metallization having high power compatibility and high electrical conductivity

摘要

A metallization can be used for components working with acoustic waves. The metallization includes a base having a bottom layer comprising titanium, and an upper layer comprising copper. A top layer of the metallization disposed on the base comprises aluminum.

主权项

1. A metallization for carrying current in an electrical component, the metallization comprising:
a bottom layer overlying a substrate surface and comprising Ti or a titanium compound as main constituent; an upper layer overlying the bottom layer and comprising Cu as main constituent, wherein the bottom layer and the upper layer form a base layer; and a top layer in direct contact with the upper layer and comprising Al as main constituent, wherein the top layer has a <1 1 1> texture, wherein in the base layer further comprises a middle layer that is arranged between the bottom layer and the upper layer, the middle layer comprising an element that is nobler than Al, wherein the middle layer consists of Ag.