Transmit/receive daughter card with integral circulator

摘要

A mixed-signal, multilayer printed wiring board fabricated in a single lamination step is described. The PWB includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the PWB. The PWB includes a number of unit cells with radiating elements and an RF cage disposed around each unit cell to isolate the unit cell. A plurality of flip-chip circuits are disposed on an external surface of the PWB and a heat sink can be disposed over the flip chip components.

主权项

1. A transmit receive (T/R) daughter card assembly comprising:
a printed circuit board (PCB) having first and second opposing surfaces and having a plurality unit cells with each unit cell having one or more electrical contacts on the first surface of said PCB and each unit cell having one or more electrical contacts on the second opposing surface of said PCB; a plurality of radio frequency (RF) circulators disposed on a first one of the first and second surfaces of said PCB, each of said circulators disposed within the boundaries of a respective one of said plurality of unit cells, and each of said circulators electrically coupled to at least some of the one or more electrical contacts within the respective unit cell; a thermally and electrically conductive layer disposed on the first one of the first and second surfaces of said PCB, said circulator thermally and electrically conductive layer in thermal and electrical contact with said plurality of circulators; one or more RF integrated circuits disposed on a second, opposite one of the first and second surfaces of said PCB, each of said RF integrated circuits disposed within the boundaries of a respective one of said plurality of unit cells and each of said RF integrated circuits electrically coupled to at least some of the one or more electrical contacts on the second surface of said PCB within the unit cell in which the one or more RF integrated circuit is disposed; one or more thermal vias disposed through said PCB to provide thermal paths from the said thermally and electrically conductive layer disposed on the first one of the first and second surfaces of said PCB to the second opposing surface of said PCB; and one or more heat spreaders disposed on the second one of the first and second surfaces of said PCB which is opposite the surface on which the circulators are mounted, said one or more heat spreaders thermally coupled to said thermally and electrically conductive layer disposed on the first one of the first and second surfaces of said PCB through at least one of the one or more thermal vias.